2002, ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… Altro …
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A Guide to Lead-free Solders: Physical Metallurgy and Reliability - edizione con copertina flessibile
2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-13T00:00:01Z, Produktgru… Altro …
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2010, ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… Altro …
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A Guide to Lead-free Solders: Physical Metallurgy and Reliability - edizione con copertina flessibile
2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-18T00:00:01Z, Produktgru… Altro …
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2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… Altro …
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2002, ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… Altro …
Evans, John W.:
A Guide to Lead-free Solders: Physical Metallurgy and Reliability - edizione con copertina flessibile2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-13T00:00:01Z, Produktgru… Altro …
2010
ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… Altro …
A Guide to Lead-free Solders: Physical Metallurgy and Reliability - edizione con copertina flessibile
2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-18T00:00:01Z, Produktgru… Altro …
2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… Altro …
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Informazioni dettagliate del libro - A Guide to Lead-free Solders
EAN (ISBN-13): 9781849965774
ISBN (ISBN-10): 1849965773
Copertina rigida
Copertina flessibile
Anno di pubblicazione: 2010
Editore: Springer London
220 Pagine
Peso: 0,339 kg
Lingua: eng/Englisch
Libro nella banca dati dal 2011-05-18T11:37:04+02:00 (Rome)
Pagina di dettaglio ultima modifica in 2023-12-27T18:40:03+01:00 (Rome)
ISBN/EAN: 1849965773
ISBN - Stili di scrittura alternativi:
1-84996-577-3, 978-1-84996-577-4
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : john evans, eva engel, werner eva
Titolo del libro: physical metallurgy, lead
Dati dell'editore
Autore: John W. Evans
Titolo: A Guide to Lead-free Solders - Physical Metallurgy and Reliability
Editore: Springer; Springer London
206 Pagine
Anno di pubblicazione: 2010-10-13
London; GB
Stampato / Fatto in
Lingua: Inglese
133,70 € (DE)
137,45 € (AT)
179,85 CHF (CH)
POD
XIV, 206 p. 114 illus.
BC; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; Lead Substitutes; Metall; Solder Alloys; Standard; architecture; cutting; design; electronics; manufacturing; materials; metal; metallurgy; microstructure; production; reliability; quality control, reliability, safety and risk; Electronics and Microelectronics, Instrumentation; Metals and Alloys; Optical Materials; Security Science and Technology; Mechanical Engineering; Machines, Tools, Processes; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Sicherheitssysteme und Brandmeldeanlagen; Maschinenbau; Fertigungstechnik und Ingenieurwesen; BB
to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.Covers all aspects of lead-free solders from physical properties to product assurance The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weaknesses and with the properties of the lead-based solders currently in use The theoretical basis of the book will allow solder producers to make solders with more desirable properties in the future Includes supplementary material: sn.pub/extras
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