ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … Altro …
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2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … Altro …
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, [PU: Springer US], Springer US, 2009
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
2009
ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … Altro …
2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … Altro …
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Informazioni dettagliate del libro - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909848
ISBN (ISBN-10): 1441909842
Anno di pubblicazione: 2009
Editore: Springer
285 Pagine
Lingua: eng/Englisch
Libro nella banca dati dal 2010-05-22T01:59:03+02:00 (Rome)
Pagina di dettaglio ultima modifica in 2023-06-25T14:40:54+02:00 (Rome)
ISBN/EAN: 9781441909848
ISBN - Stili di scrittura alternativi:
1-4419-0984-2, 978-1-4419-0984-8
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : cahill, kuang
Titolo del libro: self packaging, microwave for one, microelectronics
Dati dell'editore
Autore: Ken Kuang; Franklin Kim; Sean S. Cahill
Titolo: RF and Microwave Microelectronics Packaging
Editore: Springer; Springer US
285 Pagine
Anno di pubblicazione: 2009-12-01
New York; NY; US
Lingua: Inglese
149,79 € (DE)
154,00 € (AT)
177,00 CHF (CH)
Available
XVI, 285 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; C; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Engineering; Schaltkreise und Komponenten (Bauteile); BB
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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